TE Connectivity
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Comment | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
| RoHSELV Compliance | Not reviewed for ELV/RoHS compliance |
| Lead Free Solder Processes | Not reviewed for lead free solder process |
| Finish | Black Anodize |
| Height (mm (in)) | 17.22 [0.678] |
| Diameter (mm in) | 50.80 [2.000] |
| Material | Aluminum |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Heat Sink Type | 5 Fin Radial |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| Package Size (mm (in)) | 25 [.985] |
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