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Thumbnail 2-5916783-2 Thumbnail 2-5916783-2 Thumbnail 2-5916783-2 Thumbnail 2-5916783-2 Thumbnail 2-5916783-2
厂商型号:

2-5916783-2

芯天下内部编号:
35-2-5916783-2
生产厂商:

TE Connectivity / AMP

microsemi
描述:
I
客户编号:

所示图像仅为示意图。请从产品数据表中获得准确的规格。

产品参数

Type Description
Heat Sink Style Universal
Pick and Place Cover None
Contact Style Stamped + Formed
Housing Material Liquid Crystal Polymer (LCP)
Application Production
ZIF Actuator Handle
Cover Color Natural
Chip Compatibility Intel® Celeron®, Intel® Pentium lll, Sun® UltraSPARC? lIe
PCB Mount Style Thru Hole
Number of Positions 370
Profile Low
Lead Free Solder Processes Reflow solder capable to 245°C, Reflow solder capable to 260°C
Solder Tail Contact Plating Tin over Nickel
Brand AMP
Housing Color Natural
Leg Style Standard
RoHSELV Compliance RoHS compliant, ELV compliant
Frame Style Open
Packaging Method Tray
Packaging Quantity 90 sockets/box
Heat Sink Attachment With
Contact Mating Area Plating Material Gold (30)
Insertion Force Zero
Housing Flammability Rating UL 94V-0
Grid Spacing (mm (in)) Interstitial: 1.27 x 2.54 [.050 x .100]
Socket Identifier PGA370
Grid Size 19x19
Cover Material Liquid Crystal Polymer (LCP)
Housing Material Temperature High
Contact Material Copper Alloy
RoHSELV Compliance History Always was RoHS compliant
Handle Type Jog
Termination (Solder) Post Length (mm (in)) 2.36 [0.093]
Features Open Frame
Mounting Type Through Hole
Pitch 0.100" (2.54mm)
Contact Finish Gold
Number of Positions or Pins (Grid) 370 (19 x 19)
Standard Package 990
Contact Finish Thickness 30µin (0.76µm)
Type PGA, ZIF (ZIP)
rohs Lead free / RoHS Compliant
Body Orientation Straight
Contact Plating Gold
Gender Female
Number of Contacts 370
Package Type PGA
Socket Mounting Type Through Hole
Termination Method Solder
Connector Type :PGA Socket
No. of Contacts :370
Pitch Spacing :1.27mm
Row Pitch :1.27mm
Contact Termination :Solder
Weight (kg) 0.023
Tariff No. 85366910
库存: 0
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输入数量
定价(所有价格均为人民币含税价)
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