TE Connectivity / AMP
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Heat Sink Style | Universal |
| Pick and Place Cover | None |
| Contact Style | Stamped + Formed |
| Housing Material | Liquid Crystal Polymer (LCP) |
| Application | Production |
| ZIF Actuator | Handle |
| Cover Color | Natural |
| Chip Compatibility | Intel® Celeron®, Intel® Pentium lll, Sun® UltraSPARC? lIe |
| PCB Mount Style | Thru Hole |
| Number of Positions | 370 |
| Profile | Low |
| Lead Free Solder Processes | Reflow solder capable to 245°C, Reflow solder capable to 260°C |
| Solder Tail Contact Plating | Tin over Nickel |
| Brand | AMP |
| Housing Color | Natural |
| Leg Style | Standard |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Frame Style | Open |
| Packaging Method | Tray |
| Packaging Quantity | 90 sockets/box |
| Heat Sink Attachment | With |
| Contact Mating Area Plating Material | Gold (30) |
| Insertion Force | Zero |
| Housing Flammability Rating | UL 94V-0 |
| Grid Spacing (mm (in)) | Interstitial: 1.27 x 2.54 [.050 x .100] |
| Socket Identifier | PGA370 |
| Grid Size | 19x19 |
| Cover Material | Liquid Crystal Polymer (LCP) |
| Housing Material Temperature | High |
| Contact Material | Copper Alloy |
| RoHSELV Compliance History | Always was RoHS compliant |
| Handle Type | Jog |
| Termination (Solder) Post Length (mm (in)) | 2.79 [0.110] |
| Features | Open Frame |
| Mounting Type | Through Hole |
| Pitch | 0.100" (2.54mm) |
| Contact Finish | Gold |
| Number of Positions or Pins (Grid) | 370 (19 x 19) |
| Standard Package | 1,260 |
| Contact Finish Thickness | 30µin (0.76µm) |
| Type | PGA, ZIF (ZIP) |
| rohs | Lead free / RoHS Compliant |
| Factory Pack Quantity | 90 |
| Product | PGA Sockets |
| Product Category | IC & Component Sockets |
| Mounting Style | PCB |
| Packaging | Tray |
| Number of Positions / Contacts | 370 |
| Contact Plating | Gold |
| RoHS | RoHS Compliant |
| Standard Pack: | 90 |
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