te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Standard Package | Trays |
| Mounting Type | Through Hole |
| Color | Black |
| Pitch | 0.079" (2.00mm) |
| Connector Type | Receptacle |
| Contact Finish | Gold |
| Packaging | Tray |
| Number of Rows | 2 |
| Height Above Board | 0.177" (4.50mm) |
| Termination | Solder |
| Contact Finish Thickness | 8µin (0.20µm) |
| Row Spacing | 0.079" (2.00mm) |
| Number of Positions | 44 |
| Number of Positions Loaded | All |
| rohs | Contains lead / RoHS Compliant |
| Housing Material | Thermoplastic |
| Mounting Angle | Vertical |
| Product Category | Board to Board & Mezzanine Connectors |
| Current Rating | 1 A |
| Contact Plating | Gold |
| Voltage Rating | 200 V |
| Series | 2mm AMPMODU |
| Termination Style | Through Hole |
| Stack Height | 4.5 mm |
| Number of Positions / Contacts | 44 |
| Tradename | AMPMODU |
| Product Type | Receptacles |
| RoHS | RoHS Compliant |
| Contact Material | Copper Alloy |
| 连接器类型 | 连接器组件 |
| Centerline (Pitch) | 2 mm [ .079 in ] |
| 堆叠高度 | 4.5 mm [ .177 in ] |
| 端子类型 | 插座 |
| 封装方法 | 托盘, 盒和托盘 |
| 柱体尺寸 | .5 mm [ .02 in ] |
| 端子基材 | 铜合金 |
| 行数 | 2 |
| 拾放盖 | 不带 |
| 焊尾端子电镀厚度 (µin) | 100 |
| 端子接触部电镀材料 | 金 |
| 壳体进入方式 | 封顶式 |
| PC 板端接方法 | 通孔 |
| UL 易燃性等级 | UL 94V-0 |
| 系列 | AMPMODU |
| Contact Current Rating (Max) (A) | 1 |
| 壳体颜色 | 黑色 |
| 外壳 | 不带 |
| 产品类型 | 连接器 |
| 介质耐压 (VAC) | 650 |
| 电压 (VAC) | 250 |
| PCB 安装固定 | 不带 |
| 忽略的柱体数 | 无 |
| PCB 安装方向 | 垂直 |
| 外壳材料 | 热塑性 |
| 端接柱体长度 | 2.6 mm [ .102 in ] |
| 焊尾端子电镀材料 | 镍打底镀锡 |
| 选择性装载 | 否 |
| 连接器种类 | 母端 |
| 绝缘电阻 (MΩ) | 1000 |
| 行间距 | 2 mm [ .079 in ] |
| 端子接触部电镀厚度 (µm) | 8 |
| PCB 厚度（建议） | 1.57 mm [ .062 in ] |
| 连接器和端子端接到 | 印刷电路板 |
| 工组温度范围 (°C) | -40 – 105 |
| 已批准的标准 | CSA LR7189 |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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