te connectivity / amp
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Type | Passive |
| Device Cooled | BGA |
| Attachment Method | Clip |
| Product Height | 12.7 mm |
| Fin Style | Pin Array |
| Finish | Black Anodized |
| Material | Aluminum|Cold-Forged Aluminum |
| Standard Package | Bulk |
| Comment | Mounting clip does not increase overall heat sink height.; Heat sink assembly i |
| RoHSELV Compliance | RoHS compliant, ELV compliant |
| Lead Free Solder Processes | Not relevant for lead free process |
| Height (mm (in)) | 12.70 [0.500] |
| Diameter (mm in) | 34.95 [1.376] |
| Device Type | BGA |
| Flammability Rating | UL 94V-0 |
| Fan Type | Ball/Sleeve Bearing |
| Heat Sink Type | Pin Fin 1 |
| For Use With | BGA Semiconductor Packages |
| Line | ChipCoolers |
| Product Type | Heat Sink |
| RoHSELV Compliance History | Converted to comply with RoHS directive |
| Package Size (mm in) | 23 [.906] |
| RESOURCE TYPE | LINK |
|---|---|
| Datasheets |
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