所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Board Type | :SMD Device Adapter |
| Board Material | :FR4 Epoxy Fibreglass |
| Hole Diameter | :1mm |
| External Height | :61.4mm |
| External Width | :81.7mm |
| Board Thickness | :1.5mm |
| Board Connector / Footprint | :SSOP |
| SVHC | :No SVHC (20-Jun-2013) |
| Copper Coating Density | :chem. Au 0.08 - 0.1 µm |
| Copper Thickness | :35µm |
| External Length / Height | :61.4mm |
| Hole Pitch | :2.54mm |
| Material | :Epoxied FR4 |
| No. of Copper Coated Sides | :2 |
| PCB Size | :61.40 x 81.70 mm |
| Pad Area | :1.50 mm Ø |
| Pad Diameter | :1.5mm |
| Pitch Spacing | :2.54mm |
| Weight (kg) | 0.016 |
| Tariff No. | 85340019 |
| Copper plating thickness | 35µm |
| Board type | universal |
| Laminate thickness | 1.5mm |
| Multiplicity | 1 |
| Gross weight | 1.34 g |
| Width | 61.4mm |
| Length | 81.7mm |
| Board clad type | gold plated soldering pads |
| Board varaiant | multiadapter |
| Collective package [pcs] | 10 |
| spg | 10 |
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