Roth Elektronik
所示图像仅为示意图。请从产品数据表中获得准确的规格。
| Type | Description |
|---|---|
| Base Material | Epoxy Glass Fabric Laminate |
| Copper Thickness | 35µm |
| Dimensions | 23.5 x 20 x 1.5mm |
| FR Material Grade | FR4 |
| Hole Diameter | 1mm |
| Hole Pitch | 0.65 x 0.65mm |
| Length | 23.5mm |
| Number of Sides | 2 |
| SMD Component Type | SSOP |
| Thickness | 1.5mm |
| Width | 20mm |
| Board Type | :SMD Device Adapter |
| Board Material | :FR4 Epoxy Fibreglass |
| External Height | :20mm |
| External Width | :23.5mm |
| Board Thickness | :1.5mm |
| Board Connector / Footprint | :SSOP-20 |
| SVHC | :No SVHC (20-Jun-2013) |
| Copper Coating Density | :chem. Au 0.08 - 0.1 µm |
| External Length / Height | :20mm |
| Material | :Epoxied FR4 |
| No. of Copper Coated Sides | :2 |
| No. of Holes | :20 |
| PCB Size | :20.0 x 23.5 mm |
| Pad Diameter | :1.5mm |
| Pitch Spacing | :2.54mm |
| Weight (kg) | 0.0008 |
| Tariff No. | 85340019 |
| Copper plating thickness | 35µm |
| Board type | universal |
| Laminate thickness | 1.5mm |
| Multiplicity | 1 |
| Gross weight | 1.54 g |
| Board clad type | gold plated soldering pads |
| Board varaiant | multiadapter |
| spg | 10 |
| Collective package [pcs] | 10 |
| soldering pads configuration | SSOP20 |
咨询QQ
热线电话
